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Conformal Coating, Encapsulation & Potting of Printed Circuit Boards - AS9100B & ISO 9001:2008 Certified

Conformal Coating - Plasma Etchback - Potting - Encapsulation
 
 
Conformal CoatingParylene Deposition Potting/Encapsulation Ball Grid Array Underfill Testing and Laboratory Services Plasma Etchback/Desmear Engineering, Design & Prototyping Security Programs & Secondary ServicesPlasma Equipment / Repair


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Conformal Coating, Encapsulation and Potting Services

Conformal Coating - Conformal coatings were created to form a barrier over a finished assembly to protect it against extreme environments, exposure to moisture, salt, electrical leakage, temperature fluctuation, fungus, dust, and other environmental contaminants.

Potting/Encapsulation - Potting can ruggedize for extreme environments, provide protection against shock and vibration, ensure security of sensitive designs, as well as create a barrier against moisture, fungus, dust, and corrosion.

Ball Grid Array Underfill - Underfill provides a strong mechanical bond between the BGA component and the corresponding connection to the circuit board, so that the solder joints are protected from mechanical stress.

Testing and Laboratory Services - Plasma Ruggedized Solutions provides fixturing, wiring or other requirements directly, without the need to locate additional sources or services adding time & cost to your project.

Plasma Etchback/Desmear - Etchback and Desmear processes ensure that good electrical contact is made between the interconnects and the through-plating, to insure circuit reliability.

Engineering, Design & Prototyping - We will select the ideal material, coating thickness and application method for every circuit board that we get. We can develop custom processes to selectively coat certain parts of a board. In addition, we can provide information on PCB fabrication, circuit assembly and component choices to achieve a better final result.

Security Programs & Secondary Services - The Federal Information Processing Standard (FIPS) also referred as FIPS 140-2 is a U.S. government computer security standard used to accredited cryptographic modules. Plasma Ruggedized Solutions can make your circuit assembly FIPS-compliant. Used by industries where security is extremely important, such as defense, banking and aerospace, our security programs can make a circuit board assembly protected from unauthorized access or reverse engineering.

Catalog Index - A complete index of Plasma Ruggedized Solutions manufacturing capabilities.

 

Plasma Ruggedized Solutions' Company Information

Tech Corner - Got questions about our manufacturing capabilities? Ask Tech Corner!

Quality Assurance - Plasma Ruggedized Solutions, Inc. is dedicated to providing our customers with a level of quality and service that consistently meets or exceeds expectations. We are ISO 9001:2000 Registered.

About Us - Plasma Ruggedized Solutions is the premier service provider of Conformal Coating, Potting and Encapsulating, PlasmaEtchback/Desmear and Laboratory Services.

Request Information - Request a quote for the manufacture of circuit boards utilizing our Conformal Coating, Potting and Encapsulating, PlasmaEtchback/Desmear and Laboratory Services

Contact Us - Plasma Ruggedized Solutions has two manufacturing facilities located in San Jose and Huntington Beach, California. Please contact us for your customized manufacturing needs!

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